High heat dissipation and noise issue resolution with GND reinforcement MI-PCB technology!
"MI-PCB Technology" is a new concept PCB technology that aims to efficiently solve problems by inserting thick metals with excellent thermal conductivity at appropriate positions within the PCB layers.
It possesses Thick Metal Etching & Patterning Technology. It can be used in automotive products, electric vehicles, smartphones, and more.
【Features】
■ High Thermal Performance
■ Reduces the thickness of electronic product sets
■ No need for heatsinks
■ Eliminates processes related to heatsink attachment, improving productivity
(No need for thermal grease application and eliminates the heatsink attachment process)
*For more details, please refer to the PDF document or feel free to contact us.